Available Product Solutions
The manufacturing method of OM® allows it to be manufactured close to the dimensions of the finished component. This reduces excess material and lowers machining steps. This improved efficiency in manufacturing contributes to a lower cost for the finished part.
For available dimensions and possible maximal dimensions please contact us.
Plates for Batch Furnace Applications
Heraeus OM100 is suitable for a variety of applications in semiconductor manufacturing such as batch furnace applications.
Plates made from Heraeus OM100 are the optimal choice to be integrated in pedestals for furnace applications or as adiabatic plates. The high reflectivity in combination with the low direct transmission makes OM100 the ideal material to contain heat inside the furnace and minimize energy loss due to heat dissipation.
This both enables higher thermal uniformity in the process chamber resulting in higher process yields while simultaneously lowering energy consumption, directly resulting in an improved cost of ownership.
Flanges for Batch Furnace Applications
Creating a vacuum tight seal on your process chamber is a vital process parameter. Heraeus OM100 is by far the best choice due to its unique properties that allow for an optimized surface finish.
Semiconductor batch furnaces require excellent sealing to prevent egress of process gases into the atmosphere and ingress of atmosphere into the process chamber. A tight sealing surface is therefore critical for both safety and for optimizing the process performance.
With OM100 you can achieve a perfectly sealing surface over the full lifetime of the process chamber including multiple cleaning cycles. Heraeus OM100 is capable of yielding the best surface condition in available heat isolation materials. Unlike other materials typically used in thermal isolation applications the surface of OM100 remains pristine after multiple etch cycles. This allows continued use over longer periods when compared to alternative competitor solutions which have shortened usable lifetime due to surface erosion and the increasing risk of leaking vacuum seals.
Density: 2.15 - 2.18 g/cm3
Resistivity (20°C): >1018 Ω∙m
Tensile strength: 50 MPa
Thermal expansion: 0.47 x 10-6 K-1