Fused Quartz and Silica Products for Semiconductor Applications

Fused quartz and silica is a key material in a multitude of applications in the semiconductor industry. Learn more about how to find the best fused quartz and silica for your semiconductor application.

Illustration of a blue semiconductor chip on a PCB
Heraeus Conamic manufactures fused quartz and silica products for semiconductor applications in a variety of material grades and dimensions. The provided products are characterized by high purity and material homogeneity while maintaining low bubble contents and tight dimensional tolerances.

Product Portfolio for Semiconductor Applications

The product portfolio of Heraeus Conamic for semiconductor applications can be separated into two main areas of expertise depending on the grade of fabrication involved:

  • Quartz Base Materials

    The Quartz Base Materials represent the basic product geometries made from fused quartz and silica like ingots, rods, tubes, plates and more. In this field Heraeus Conamic provides products in a standardized form that can already be matched to the final application in certain geometrical dimension like outer diameter, wall thickness or length.

  • Fabricated Quartzware

    In the area of Fabricated Quartzware, Heraeus Conamic is providing fused quartz and silica products further machined to the final application as per drawing. This enables the customer to receive Fabricated Quartzware in the final geometries from the hands of one expert provider. Fabricated Quartzware can be distinguished by the production type of the final semiconductor applications:

    Quartzware for Single Wafer Applications

    Heraeus Conamic can provide quartzware for all typical single wafer applications such as rings, windows, domes, liners and more for all relevant semiconductor processes. Solutions are available for processing wafers from 6 inch up to 12 inch (others on request).

    To ensure optimum performance of the final quartzware it is detrimental to choose the appropriate base material, surface morphology and cleanness. Heraeus Conamic can offer design support via our worldwide fabrication network connecting you with the experts in this field.

    Quartzware for Batch Furnace

    Regarding batch furnace applications, Heraeus Conamic can offer quartzware for all typical batch applications such as CVD, epitaxial deposition and other high-temperature processes. Product examples for batch systems are process tubes, liners, pedestals, gas injectors and many more complex components. Solutions are available for processing wafers from 4 inch up to 12 inch.

    Heraeus Conamic can also provide quartzware ready for install (CFI) enabling our customers to use our products directly after delivery and without any further treatment.

    To ensure optimum performance of the final quartzware Heraeus Conamic can offer design support via our worldwide fabrication network connecting you with the experts in this field.

Material Grades for Semiconductor Applications

The provided material grades of fused quartz and silica can be classified by the underlying production technology used for manufacturing the final products. In the following you can find an overview of the different material grades that Heraeus Conamic can offer, highlighted by the key feature in this application segment:

More Material Grades

Material Grade

Production Type

Application

Feature

HSQ® 100

Electric

Industrial

High thermal stability, cost-efficient solution due to single step electrical fusion process, high chemical purity

HSQ® 300

Electric

Semiconductor, solar and industrial

High thermal stability, very high chemical purity, low bubble and inclusion content

HSQ® 330 (S)

Electric

High- and super-high purity semiconductor

High thermal stability, very high chemical purity especially with tighter limits for alkaline and metal contaminations, low bubble and inclusion content

HSQ® 400

Electric

Industrial, solar, semiconductor

Very high thermal stability due to chemical stabilization layer, high chemical purity, low bubble and inclusion content

HSQ® 700

Electric

Semiconductor, industrial

High thermal stability, very high chemical purity especially low concentration of alkaline metals, low bubble and inclusion content

TSC®-3N

Flame

Semiconductor, especially suitable for etch systems

Very low bubble and inclusion content, cost-efficient solution due to high volume flame fusion process, high chemical purity

TSC®-3

Flame

Semiconductor, especially for etch systems

Very low bubble and inclusion content, very high chemical purity, also available in large geometries

TSC®-4

Flame

Semiconductor, especially for etch systems

Very low bubble and inclusion content, very high chemical purity especially low aluminum and low alkaline content, also available in large geometries

OM® 100

Sintered

Semiconductor, industrial, solar

High heat reflection, very high chemical purity, superior surface finish

HBQ® 100

Sintered

Semiconductor, solar, industrial

High thermal and optical absorption, very high chemical purity, high thermal emissivity

HSQ®-T

Synthetic

Leading edge semiconductor applications

Outstanding synthetic grade chemical purity, most elements below detection limit, available in different geometries

TSC®-T

Synthetic

Leading edge semiconductor applications, especially for etch systems

Outstanding synthetic grade chemical purity, virtually zero bubble and inclusion free, selected geometries available in large volume

Neonyx® OM

Synthetic

Leading edge semiconductor applications

Outstanding synthetic grade chemical purity, increased thermal reflection properties, also available in near net shape geometries

HSQ® 900

Synthetic

Leading edge semiconductor applications

Outstanding synthetic grade chemical purity, almost bubble and inclusion free, available in different geometries

Spectrosil® 1000

Synthetic

Leading edge semiconductor applications

Outstanding synthetic grade chemical purity, almost bubble and inclusion free, also available as large ingot material