The solution for lowest bubble and inclusion requirements for semiconductor applications

Photo of two large quartz hollow cylinders

Brand Overview

Heraeus Conamic manufactures fused quartz and silica products by utilizing different fusion technologies. The material grades and available dimensions are each optimized for their final application.

The flame fused quartz and silica* products are united under the brand TSC® as the solution for lowest bubble and inclusion requirements while maintaining high purity and material homogeneity.

* For TSC-T® synthetic soot process used

TSC® Product Portfolio

In the following you will find an overview of the different TSC® material grades that Heraeus Conamic can provide, each highlighted by the relevant features in this application segment.

Material Grade

Production Type





Semiconductor, especially suitable for etch systems

Very low bubble and inclusion content, cost-efficient solution due to high volume flame fusion process, high chemical purity



Semiconductor, especially for etch systems

Very low bubble and inclusion content, very high chemical purity, also available in large geometries



Semiconductor, especially for etch systems

Very low bubble and inclusion content, very high chemical purity especially low aluminum and low alkaline content, also available in large geometries



Leading edge semiconductor applications, especially for etch systems

Outstanding synthetic grade chemical purity, virtually zero bubble and inclusion free, selected geometries available in large volume

Fusion Methods of TSC®


In opposite to the Electrical Fusion, the Flame Fusion is not using an electric current, but is using am H2/O2-Flame to heat up and melt the material. Heraeus chemist Richard Küch was the first person to ever melt quartz over 100 years ago, he used a flame fusion process for his pioneer endeavor.

Heraeus Conamic is the only material manufacturer who can produce fused quartz in a continuous flame fusion process, combining the benefits of a continuous process with the properties of flame fused quartz.

The extreme low bubble content makes Heraeus flame fused quartz the best choice for plasma etch applications. Heraeus Conamic also offers flame fused material in very large size ingots in the range of 1.5m x 1.2m and larger.


The main difference between so-called natural quartz material and synthetic quartz material, is the used raw material. While natural quartz is produced from quartz sand minded in a quartz mine, synthetic quartz is using chemical gases as raw material. Such chemical gas containing a silicon source will be put into reaction with oxygen forming pure silicon dioxide. The purity achievable by this manufacturing procedure is magnitudes higher compared to natural quartz.

Synthetic fused quartz (sometimes also called fused silica) is the ideal choice for most demanding applications in which purity of the process environment is of the essence.

Our synthetic fused silica materials are available in the same portfolio of shape, geometry and dimensions as our electrical fused material.

Benefits of TSC®

  • Addressing key material challenges

    • Lowest inclusions and bubbles
    • Readily available in large sizes
    • Outstanding synthetic grade purity (synthetic fused silica)
  • Providing consistency for centuries

    • In-house material purification
    • > 100 years of experience
    • Improved total cost of ownership

Fields of Application

  • Focus rings for plasma etch systems
  • Windows in deposition systems
  • Covers for etching systems