Fused Quartz and Silica Hollows for Semiconductor Applications

Fused quartz and silica hollows are needed in the fabrication of single wafer processing equipment for plasma etch and deposition systems.

Heraeus Conamic manufactures fused quartz and silica hollows in different material grades and dimensions. The provided hollows are characterized by high purity and material homogeneity while maintaining low bubble contents.

Photo of two large quartz hollow cylinders
  • Fusion Technologies and Benefits

    In the following you will find an overview of the different fusion technologies that Heraeus Conamic can utilize, each highlighted by the leading material advantage in this segment.

    Natural Fused Quartz

    Flame Fused Quartz Hollows

    Heraeus Conamic uses continuous fusion technology to produce TSC® flame fused quartz hollows. This unique process allows customers to utilize material that features very low levels of bubbles and inclusions while maintaining high purity.

    Synthetic Fused Silica

    Synthetic Fused Silica Hollows

    For addressing the most demanding needs of the semiconductor industry, Heraeus Conamic produces synthetic fused silica hollows. TSC-T® is the corresponding material grade that is characterized by parts per billion class purity and zero bubble content.

  • Fields of Applications

    Fused quartz and silica hollows are available to meet the tight purity and visual requirements in the fabrication of single wafer processing equipment such as focus rings for plasma etch systems.

    The Heraeus Conamic portfolio covers multiple grades to address all OEM requirements including challenging ultra-high purity specifications.